# Principal Development Engineer — Connector & Cable Interconnect at Kandou AI Principal Development Engineer — Connector & Cable Interconnect at Kandou AI in Taipei City. Full-time. Posted October 12, 2026. - Company: Kandou AI - Location: Taipei City - Job type: Full-time - Experience: 10+ years - Posted: 2026-10-12 - Apply: https://jobs.ashbyhq.com/kandou-ai/4599f883-d1b0-4896-a0fe-7744b8a0e7a9/application - Source: https://jobmagic.ai/jobs/principal-development-engineer-connector-cable-interconnect-kandou-ai-r1wjdy ## Requirements - 10+ years of experience in high-speed interconnect, connector, or cable assembly development within the semiconductor, networking, or computing industry. - Proven track record of optimizing connector, cable-to-connector, and cable-to-PCB interfaces for high-speed differential signaling (e.g., PCIe, SerDes, 112G+/224G electrical interfaces). - Extensive hands-on experience with Ansys HFSS (or equivalent 3D electromagnetic field solvers) for connector, cable, and interconnect modeling. - Demonstrated experience leading conceptual design and architecture definition of new connector and cable interconnect systems, from early feasibility through detailed design. - Experience planning and executing Proof-of-Life (PoL) studies to validate first-pass electrical and mechanical performance of new interconnect designs. - Strong lab measurement background, including VNA, TDR, and oscilloscope-based characterization of connectors, cables, and interconnect channels. - Experience working cross-functionally with mechanical, signal integrity, package, systems, manufacturing, and customer-facing teams to align interconnect designs with product and manufacturing requirements. - Experience engaging directly with connector and cable vendors/suppliers on design-in, qualification, and manufacturability trade-offs. ## Description At **Kandou**, we are redefining the economics of AI infrastructure. Our mission is to **democratise AI by significantly reducing the Total Cost of Ownership (TCO) **of hardware systems — a critical barrier to scalable adoption. Our proprietary **MIMO-over-copper technology **powers a **high-performance, chiplet-based AI memory fabric **that is both **scalable and energy-efficient**. Unlike traditional interconnects, our solution **reduces power consumption significantly **while preserving **high bandwidth and ultra-low latency **— unlocking unprecedented efficiency for AI training and inference at scale. Kandou’s architecture is not just an incremental improvement — it’s a **foundational shift **in how AI hardware is built for the future. **Department: **Product Development and Manufacturing **Location: **Taiwan **Role Summary** The Principal Development Engineer owns the electrical and mechanical optimization of connector interfaces, cable-to-connector assemblies, and cable-to-PCB interfaces for Kandou's high-speed interconnect products. This individual drives interconnect architecture from early concept through electromagnetic simulation (HFSS), Proof-of-Life (PoL) validation, and lab measurement, partnering closely with silicon, systems, mechanical, and customer-facing teams to deliver signal-integrity-optimized, manufacturable interconnect solutions. **Responsibility and Authority** - Own the end-to-end optimization of connector, cable-to-connector, and cable-to-PCB interfaces for Kandou's interconnect products. - Lead conceptual design and architecture definition for new connector and cable interconnect solutions, evaluating electrical, mechanical, and manufacturability trade-offs. - Build and run HFSS simulation models to characterize and optimize connector and cable interface electrical performance. - Define and execute Proof-of-Life (PoL) studies to validate design intent prior to full qualification. - Perform and oversee lab measurement and characterization (VNA, TDR, oscilloscope) to validate simulation predictions and debug performance issues. - Drive design reviews and provide technical recommendations to engineering leadership, product management, and customers on interconnect design decisions. - Collaborate cross-functionally with signal integrity, mechanical, systems, manufacturing, and customer teams to align interconnect designs with overall product requirements. - Interface with connector and cable suppliers on design-in, sampling, qualification, and manufacturability. - Mentor junior engineers on simulation methodology, measurement techniques, and interconnect design best practices. - Individual responsibilities for this role are defined by Kandou's executive team on a project-by-project basis and may vary from this job description. **Required Experience** - 10+ years of experience in high-speed interconnect, connector, or cable assembly development within the semiconductor, networking, or computing industry. - Proven track record of optimizing connector, cable-to-connector, and cable-to-PCB interfaces for high-speed differential signaling (e.g., PCIe, SerDes, 112G+/224G electrical interfaces). - Extensive hands-on experience with Ansys HFSS (or equivalent 3D electromagnetic field solvers) for connector, cable, and interconnect modeling. - Demonstrated experience leading conceptual design and architecture definition of new connector and cable interconnect systems, from early feasibility through detailed design. - Experience planning and executing Proof-of-Life (PoL) studies to validate first-pass electrical and mechanical performance of new interconnect designs. - Strong lab measurement background, including VNA, TDR, and oscilloscope-based characterization of connectors, cables, and interconnect channels. - Experience working cross-functionally with mechanical, signal integrity, package, systems, manufacturing, and customer-facing teams to align interconnect designs with product and manufacturing requirements. - Experience engaging directly with connector and cable vendors/suppliers on design-in, qualification, and manufacturability trade-offs. **Required Skills** - Deep understanding of high-speed signal integrity fundamentals: S-parameters, transmission line theory, impedance control, crosstalk, and insertion/return loss. - Expert-level proficiency in HFSS for 3D full-wave electromagnetic simulation of connectors, cables, and PCB launch structures. - Strong analytical skills to correlate simulation results with lab measurement data and resolve discrepancies. - Ability to translate system-level electrical requirements into conceptual connector/cable interface designs and specifications. - Excellent cross-functional collaboration and communication skills, with the ability to influence design trade-offs across engineering disciplines. - Strong documentation skills for design reviews, test reports, and specification development. - Ability to manage multiple concurrent development programs and prioritize effectively under schedule pressure. - Strong presentation skills, with the ability to clearly convey technical findings, trade-offs, and recommendations to engineering leadership, cross-functional teams, and customers. - Working knowledge of Lean Product Development (Lean PD) principles, applying them to streamline design iteration, reduce waste, and accelerate time-to-market. - Strong written and verbal English communication skills, required. - Mandarin language proficiency is a nice-to-have, given engagement with suppliers and customers in Mandarin-speaking regions. - Ability and willingness to travel internationally to support supplier reviews, lab bring-ups, and customer engagements. **Required Competencies – Education** - Bachelor's or Master's degree in Electrical Engineering, Electronics Engineering, or an equivalent field. - Advanced coursework or demonstrated expertise in electromagnetics, RF/microwave engineering, or high-speed signal integrity is desired.