# Customer Platform, SDK & Interoperability Architect - Randa 1.6T AEC Platform at Kandou AI

Customer Platform, SDK & Interoperability Architect - Randa 1.6T AEC Platform at Kandou AI in Hyderabad. Hybrid, full-time. Posted October 12, 2026.

- Company: Kandou AI
- Location: Hyderabad
- Workplace: Hybrid
- Job type: Full-time
- Experience: 10+ years
- Posted: 2026-10-12
- Apply: https://jobs.ashbyhq.com/kandou-ai/24f8870f-7692-47ee-81ae-452e04ae4575/application
- Source: https://jobmagic.ai/jobs/customer-platform-sdk-interoperability-architect-randa-16t-aec-platform-kandou-a-2kvpgf

## Description

At **Kandou**, we are redefining the economics of AI infrastructure. Our mission is to **democratise AI by significantly reducing the Total Cost of Ownership (TCO) **of hardware systems — a critical barrier to scalable adoption.
Our proprietary **MIMO-over-copper technology **powers a **high-performance, chiplet-based AI memory fabric **that is both **scalable and energy-efficient**. Unlike traditional interconnects, our solution **reduces power consumption significantly **while preserving **high bandwidth and ultra-low latency **— unlocking unprecedented efficiency for AI training and inference at scale.

We are looking for a **Customer Platform, SDK & Interoperability Architect.Location:** Hyderabad, India

**Responsabilities**
· Architect the customer-facing software platform for Randa, including the adaptation layer, SDK, diagnostic tools, telemetry interfaces and reference integrations.
· Define stable APIs, extension points and versioning contracts that support customer-specific requirements without forking the core platform.
· Own C and Python management libraries, command-line tools, log-analysis utilities, integration examples and developer documentation.
· Lead interoperability and qualification across NIC, switch-ASIC and host-BMC platforms; maintain the test matrix, known-failure catalog and regression strategy.
· Represent Kandou software in customer technical discussions and escalations, converting field requirements into governed, reusable platform capabilities.
· Partner with firmware, platform validation, product management and field engineering to deliver secure, backward-compatible and supportable customer releases.

**Essential Experience**
· 10+ years of platform, embedded or systems software experience, including architecture or technical leadership on shipping products.
· Device-adjacent software experience on networking silicon, AEC/AOC, optical modules, retimers, storage or comparable high-speed hardware.
· Strong API and SDK architecture skills with hands-on C and/or C++ plus Python development.
· Experience designing adaptation, plugin or hook-based architectures that isolate customer-specific logic behind stable interfaces.
· Customer or OEM integration experience across NICs, switch platforms, BMCs, drivers or management software.
· Experience with semantic versioning, backward compatibility, release governance and technical documentation for external developers.
· Working knowledge of hardware management and sideband interfaces such as I2C/SMBus, MCTP or similar protocols.
Excellent customer communication, technical decision-making and cross-functional leadership skills; BS in Electrical Engineering, Computer Engineering or Computer Science, or equivalent experience.

**Useful Experience**
· CMIS, OSFP MSA, SFF conventions or pluggable-module management software.
· Hyperscaler or tier-one OEM qualification and field-issue triage.
· REST, gRPC, Go or Rust bindings, and schema-driven API development.
· Telemetry pipelines, diagnostic analytics and privacy-aware customer data handling.
· Hardware-in-loop lab automation, host emulation and automated interoperability testing.
· Secure software supply chain, artifact signing, access isolation and standards-group participation.

If this is the role you have been looking for and you want to be part of a growing Company, with an exciting future then we would love to hear from you. Together We Kandou It!!